Nauen, Germany — January 28, 2026 — PacTech – Packaging Technologies GmbH, a leading provider of laser-based bonding equipment and advanced wafer-level packaging services, today announced that it has joined the Glass Panel Technology Group, an international consortium led by Fraunhofer IZM focused on accelerating the development and industrialization of glass-based substrates for future semiconductor packaging.

By joining the consortium, PacTech reaffirms its commitment to advancing Laser-Assisted Reflow (LAR), a key enabling technology for fine-pitch, high-density, and thermo-sensitive packaging architectures on emerging panel substrates, including glass.

LAR: A Critical Enabler for Glass-Based and Next-Generation Interconnects

As device pitches shrink and substrate materials diversify, conventional reflow processes face increasing limitations due to high thermal exposure, warpage, mechanical stress and constraints on processing large substrates.

Laser-Assisted Reflow (LAR) technology, one of PacTech’s many proprietary laser-based bonding processes on its industry-leading LAPLACE ® assembly platforms, overcomes these challenges by applying highly controlled, precision opto-thermal energy exactly where it matters most: directly at the interconnect. This approach significantly reduces thermal stress, improves bond integrity on thermo-sensitive materials, and supports scalable processing on large-area panels.

„Glass is emerging as a highly attractive substrate for heterogeneous integration, with panels of 600 × 600 mm pushing the limits due to their brittleness and extreme warpage. Handling and processing these large sizes require existing technologies to be upgraded or entirely reimagined unlocking huge opportunities for innovation while LAR is perfectly suited to meet the material’s unique challenges,” said Matthias Fettke, Vice President of the Advanced Packaging Equipment Business Unit at PacTech. “Together with leading partners in the group, PacTech drives the development of industrially viable assembly solutions, qualifying its precise, low-stress bonding technologies as part of the supply chain for market readiness, thereby paving the way for next-generation system-in-package and advanced chiplet architectures.”

Participation in the Glass Panel Technology Group aligns with PacTech’s long-term roadmap to support advanced packaging innovations, chiplet architectures, and heterogeneous system-in-package (SiP) platforms.

About PacTech

PacTech is a global leader in manufacturing laser assisted bonding, laser assisted reflow and solder balling/jetting equipment as well as wet chemical plating lines. The company also offers plating chemistries and high-volume subcontractor bumping and die preparation services for semiconductors, catering to diverse applications in consumer electronics, automotive, aerospace, sensors, MEMS, RF, and AI technologies. With manufacturing facilities in Germany (HQ), the USA, and Malaysia, PacTech is well-positioned to support the evolving needs of the semiconductor industry worldwide.

Media Contact

Thomas Oppert
Vice President of Sales
PacTech – Packaging Technologies GmbH
Email: [email protected]
Website: https://pactech.com/

Wir, die PacTech – Packaging Technologies GmbH, bieten

Ausbildungsplätze zum Fachinformatiker (m/w/d) für Systemintegration

an unserem Standort in Nauen an.

Wenn du die Welt der IT liebst, bist du hier genau in deinem Element!

Als Fachinformatiker planst, installierst und betreibst du komplexe IT-Systeme und sorgst dafür, dass Hard- und Software reibungslos funktionieren. Du analysierst technische Störungen, findest schnell die passende Lösung und stellst sicher, dass unsere Systeme jederzeit zuverlässig laufen.

Fachinformatiker für Systemintegration arbeiten verantwortungsbewusst und strukturiert – besonders, wenn es um IT-Sicherheit, Datenschutz, Netzwerkinfrastruktur und Qualitätssicherung geht. Du dokumentierst deine Arbeitsschritte, unterstützt Kolleginnen und Kollegen bei technischen Fragen und trägst aktiv dazu bei, unsere IT-Landschaft modern und stabil zu halten.

Berufsschule: OSZ Technik / Teltow

Dauer: 3 Jahre (bei guten Berufsschulnoten ist eine Verkürzung auf 2,5 Jahre möglich)

PacTech – Packaging Technologies GmbH
Am Schlangenhorst 7-9
14641 Nauen
Germany

Wir, die PacTech – Packaging Technologies GmbH, bieten

Ausbildungplätze zum Technischen Produktdesigner (m/w/d)

an unserem Standort in Nauen an.

Wenn du technisches Verständnis mit Kreativität verbinden möchtest, bist du hier genau richtig!

Bei uns entwickelst du detaillierte Modelle und Konstruktionszeichnungen, die die Basis für unsere maßgeschneiderten Anlagen bilden. Du setzt Anforderungen in präzise CAD-Entwürfe um, optimierst Bauteile und denkst dabei stets funktional, wirtschaftlich und praxisorientiert.

In diesem Beruf arbeitest du sorgfältig und verantwortungsbewusst. Du begleitest deine Konstruktionen durch den gesamten Entwicklungsprozess, dokumentierst deine Ergebnisse und trägst maßgeblich dazu bei, dass aus Ideen perfekt funktionierende Anlagen entstehen.

Berufsschule: OSZ Informations- & Medizintechnik / Berlin

Dauer: 3,5 Jahre (bei guten Berufsschulnoten ist eine Verkürzung auf 3 Jahre möglich)

PacTech – Packaging Technologies GmbH
Am Schlangenhorst 7-9
14641 Nauen
Germany

Wir, die PacTech – Packaging Technologies GmbH, bieten

Ausbildungplätze zum Mechatroniker (m/w/d)

an unserem Standort in Nauen an.

In dir steckt ein Tüftler? Du interessierst dich für Elektronik und Technik? Dann ist diese Ausbildung genau das Richtige für dich. In diesem Beruf verbinden sich die Berufsgruppen der Mechaniker und Elektroniker. Du baust mechanische, elektrische und elektronische Bauteile in Maschinen und Produktionsanlagen ein.

Berufsschule: Eduard-Maurer-Oberstufenzentrum / Hennigsdorf
Dauer: 3 ½ Jahre (bei guten Berufsschulnoten ist eine Verkürzung auf 3 Jahre möglich)

PacTech – Packaging Technologies GmbH
Am Schlangenhorst 7-9
14641 Nauen
Germany

Position location: Remote or Hybrid

Description

PacTech is a technology-focused company specializing in advanced packaging equipment manufacturing and wafer level services. Since our inception, our teams have been working relentlessly on developing new leading-edge technologies for next generation applications.
We are known to be highly adaptive to customization and unique applications. PacTech has been serving the semiconductor industry providing wafer plating, soldering and die sort subcontractor processing since 1995. Our Headquarters are located in Nauen Germany, with two operation and manufacturing sites in Santa Clara, CA, USA and Penang Malaysia. To support our expanding equipment, install base in the US, we’re seeking additional Field Service Engineers to join our dynamic, technology-driven company.

Summary of Responsibilities:

Field Service Engineers (FSE) play a crucial role in delivering exceptional onsite customer service and support at our customer facilities. Responsibilities include proficiently handling equipment installations, upgrades, repairs, and conducting preventative maintenance on
sophisticated semiconductor packaging equipment. Collaborating closely with customers, our FSEs ensure the PacTech equipment operates at best possible performance levels.

328 Martin Ave
Santa Clara, CA 95050
USA

Wir, die PacTech – Packaging Technologies GmbH, bieten

Ausbildungplätze zum Mikrotechnologen (m/w/d)

an unserem Standort in Nauen an.

Sensoren und Mikrochips faszinieren dich? Bei der Herstellung mikrotechnischer Systeme mit ihren winzigen Bauteilen und Kontakten ist deine gewissenhafte und sorgfältige Arbeitsweise gefragt. In diesem Beruf befässt du dich mit physikalischen, chemischen und mechanischen Prozessschritten, welche in der Regel durch High-Tech Maschinen durchgeführt werden.

Berufsschule: Lise-Meitner Schule / Berlin

Dauer: 3 Jahre (Verkürzung auf 2½ Jahre möglich)

PacTech – Packaging Technologies GmbH
Am Schlangenhorst 7-9
14641 Nauen
Germany

To support our team in PacTech Asia in Malaysia, we are looking for a Process Engineer for the next possible date.

PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Since our establishment, our team has been working relentlessly on developing new leading-edge technologies for the next generation applications. We are known to be highly adaptive to customization and unique applications. Our team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement. Our headquarter is located in Nauen, Germany with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. Together with our sales and field service teams across the globe, we can cater to the demand within your region.

PacTech Asia Sdn. Bhd.
No. 14, Medan Bayan Lepas, Technoplex, Phase 4, Bayan Lepas Industrial Zone
11900 Bayan Lepas, Penang, Malaysia

To support our team in PacTech Asia in Malaysia, we are looking for a Design Engineer (m/f/d) for the next possible date.

PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Since our establishment, our team has been working relentlessly on developing new leading-edge technologies for the next generation applications. We are known to be highly adaptive to customization and unique applications. Our team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement. Our headquarter is located in Nauen, Germany with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. Together with our sales and field service teams across the globe, we can cater to the demand within your region.

PacTech Asia Sdn. Bhd.
No. 14, Medan Bayan Lepas, Technoplex, Phase 4, Bayan Lepas Industrial Zone
11900 Bayan Lepas, Penang, Malaysia

To support our team in PacTech Asia in Malaysia, we are looking for a IT Application Developer for the next possible date.

PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. Since our establishment, our team has been working relentlessly on developing new leading-edge technologies for the next generation applications. We are known to be highly adaptive to customization and unique applications. Our team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement. Our headquarter is located in Nauen, Germany with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. Together with our sales and field service teams across the globe, we can cater to the demand within your region.

PacTech Asia Sdn. Bhd.
No. 14, Medan Bayan Lepas, Technoplex, Phase 4, Bayan Lepas Industrial Zone
11900 Bayan Lepas, Penang, Malaysia