Latest about EUV
IBM and Lam's new partnership paves the way toward sub-1nm logic using High-NA EUV
Premium Under the new agreement, the focus will shift to validating full process flows for nanosheet and nanostack device architectures and backside power delivery.
China's top chip execs claim ASML alternative 'small, fragmented, and weak'
China's most senior semiconductor executives issued a public call this week for a consolidated national effort to build a domestic alternative to Dutch lithography giant ASML.
Imec's new post-exposure bake method speeds up EUV chipmaking tools, boosting production for the most advanced chips
Increased oxygen concentration during the EUV lithography post-exposure bake step can increase photoresist performance by 15% - 20%, according to Imec's findings.
ASML makes breakthrough in EUV chipmaking tech, plans to increase speed by 50% by 2030
ASML to use a new CO2 laser system and tin droplet generator to increase EUV light source performance to 1000W and lithography tool productivity to 330 wafers per hour in 2030 and beyond.
ASML projects $71 billion in revenue by 2030, as demand for EUV lithography machines intensifies due to AI boom
Premium ASML is on track to boost its annual sales to up to $71 billion by 2030 as demand for EUV tools set records.
Samsung's Taylor, Texas fab could herald a breakthrough for the chipmaker, company plans 2026 risk production
Premium 50,000 wafer starts per month?
TSMC's average wafer prices increased by over 15% each year since 2019, report suggests
Premium TSMC hits a home run in the EUV era.
China's reverse-engineered Frankenstein EUV chipmaking tool hasn't produced a single chip
Premium Recreating an entire supply chain is incredibly difficult
